Manufacturing apparatus, manufacturing method and packaged device

ABSTRACT

It is an objective of the present invention to eliminate wafer testing. Provided is a manufacturing apparatus comprising a detecting section that detects a position of a device terminal of a device; a generating section that generates a substrate-side terminal, which connects to the device terminal, on a substrate at a position corresponding to the device terminal; and a mounting section that mounts the device on the substrate and connects the device terminal to the substrate-side terminal. The detecting section captures an image of the device and detects the position of the device terminal based on the captured image, and the generating section prints a pattern of the substrate-side terminal on the substrate at a position corresponding to the device terminal.

BACKGROUND

1. Technical Field

The present invention relates to a manufacturing apparatus and amanufacturing method for manufacturing a device, and to a packageddevice.

2. Related Art

A known apparatus for testing a plurality of devices formed on asemiconductor wafer uses a probe card that can contact a large number ofelectrodes of the wafer en bloc (see Patent Document 1). This apparatusis placed in an analyzing device while the probe card is in contact withthe wafer under test, and analysis is performed at a high temperature,for example. Patent Document 2 describes an apparatus that houses chipsin a package that is the same as the commercial package, and tests thechips in this state.

-   Patent Document 1: Japanese Patent Application Publication No.    2006-173503-   Patent Document 2: Japanese Patent No. 4122102

However, in each of the above apparatuses, a large number of wires mustbe connected to manufacture the probe card, and this incurs a high cost.Furthermore, it is difficult to adjust the relative positions of thewafer under test and the probe card. When testing chips after dicingthat are housed in a package that is the same as the commercial package,the package configuration is complicated and the cost of the package ishigh.

SUMMARY

Therefore, it is an object of an aspect of the innovations herein toprovide a manufacturing apparatus, a manufacturing method, and apackaged device, which are capable of overcoming the above drawbacksaccompanying the related art. The above and other objects can beachieved by combinations described in the independent claims. Thedependent claims define further advantageous and exemplary combinationsof the innovations herein.

In order to solve the above problems, according to a first aspectrelated to the innovations herein, provided is a manufacturing apparatuscomprising a detecting section that detects a position of a deviceterminal of a device; a generating section that generates asubstrate-side terminal, which connects to the device terminal, on asubstrate at a position corresponding to the device terminal; and amounting section that mounts the device on the substrate and connectsthe device terminal to the substrate-side terminal. Also provided is amanufacturing method.

According to a second aspect related to the innovations herein, providedis a packaged device comprising a device that includes an electroniccircuit; a first substrate on which the device is mounted: and aflexible second substrate that sandwiches the device together with thefirst substrate, by being placed on a surface of the first substrate onwhich the device is mounted.

The summary clause does not necessarily describe all necessary featuresof the embodiments of the present invention. The present invention mayalso be a sub-combination of the features described above.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a configuration of a device manufacturing system 10according to an embodiment of the present invention.

FIG. 2 shows an exemplary packaged device that is packaged in a testpackage manufactured by the device manufacturing system 10 according tothe present embodiment.

FIG. 3 shows a process flow of the device manufacturing system 10according to the present embodiment.

FIG. 4 shows a functional configuration of the test packaging section14.

FIG. 5 shows a process flow of the test packaging section 14 accordingto the present embodiment.

FIG. 6 shows an exemplary operation of the test packaging section 14performed from step S21 to step S24 of FIG. 5.

FIG. 7 shows an exemplary operation of the test packaging section 14performed at step S25 of FIG. 5.

FIG. 8 shows an exemplary connection between the first device terminals42 of the device 30 and the first substrate-side terminals 52 of thefirst substrate 32.

FIG. 9 shows an exemplary operation of the test packaging section 14performed from step S26 to step S32 of FIG. 5.

FIG. 10 shows an exemplary operation of the test packaging section 14performed at step S33 of FIG. 5.

FIG. 11 shows an exemplary connection between the second deviceterminals 44 of the device 30 and the second substrate-side terminals 56of the second substrate 34.

FIG. 12 shows an exemplary connection between the first wires 54 of thefirst substrate 32 and the third wires 62 of the second substrate 34.

FIG. 13 shows an exemplary connection via terminal balls 66 formedbetween the device 30 and the first substrate 32.

FIG. 14 shows an exemplary test cell 70.

FIG. 15 shows an exemplary cell matrix 80.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, some embodiments of the present invention will bedescribed. The embodiments do not limit the invention according to theclaims, and all the combinations of the features described in theembodiments are not necessarily essential to means provided by aspectsof the invention.

FIG. 1 shows a configuration of a device manufacturing system 10according to an embodiment of the present invention. The devicemanufacturing system 10 manufactures a packaged device from a circularwafer on which a plurality of devices 30 are formed. The devicemanufacturing system 10 includes a dicing section 12, a test packagingsection 14, a testing section 16, a removing section 18, and acommercial packaging section 20.

The dicing section 12 dices the wafer on which devices 30 havingelectronic circuits are formed, to separate the devices 30 as chips. Thetest packaging section 14 packages the devices 30 resulting from thedicing by the dicing section 12 in test packages.

The testing section 16 tests the devices 30 packaged in the testpackages, as a device under test. The testing section 16 may be a testapparatus that tests a semiconductor circuit, for example.

The removing section 18 removes the devices 30 that have been testedfrom the test packages. The commercial packaging section 20 packages thedevices 30 removed from the test packages in commercial packages.

FIG. 2 shows an exemplary packaged device 28 for testing. The packageddevice 28 for testing includes a device 30 in chip form, a firstsubstrate 32, and a second substrate 34.

The device 30 in chip form is loaded on the first substrate 32. Thesecond substrate 34 is a flexible substrate. The second substrate 34 islayered on the surface of the first substrate 32 on which the device 30is mounted, and sandwiches the device 30 together with the firstsubstrate 32.

The packaged device 28 includes the device 30 held between twosubstrates, and therefore the packaged device 28 is easier to handlethan just a chip. For example, the packaged device 28 can be handled bya test apparatus for testing a device that is commercially packaged.

FIG. 3 shows a process flow of the device manufacturing system 10according to the present embodiment. First, at step S11, the dicingsection 12 separates the devices 30 into chip form by dicing the waferon which the devices 30 are formed.

Next, at step S12, the test packaging section 14 individually packageseach of the devices 30 in chip form cut at step S11 into a test packagecreated for each device 30. The test packaging section 14 may seal eachdevice 30 inside a test package, for example.

As an example, as shown in FIG. 2, the test packaging section 14 mayseal each device 30 between the first substrate 32 and the secondsubstrate 34 by suctioning out the gas between the first substrate 32and the second substrate 34, at least one of which is a flexiblesubstrate. In the present embodiment, the test packaging section 14affixes the second substrate 34, which is a flexible substrate, to thefirst substrate 32 and the device 30 using vacuum suction ordecompression suction.

As another example, the test packaging section 14 may sandwich thedevice 30 between the first substrate 32 and the second substrate 34 byusing a tensile force to press the second substrate 34, which is aflexible substrate, against the first substrate 32. A detaileddescription of the packaging method of step S12 is provided furtherbelow in FIG. 4 and onward.

Next, at step S13, the test packaging section 14 mounts the device 30,which is packaged in the test package, onto a test substrate forconnecting the device 30 to an external apparatus. If the externalapparatus can directly exchange signals with the device 30 packaged inthe test package, there is no need to mount the device 30 on the testsubstrate.

Next, at step S14, the testing section 16 exchanges signals with thedevice 30 via the test substrate to test the device 30 packaged in thetest package. In this case, the testing section 16 may test a pluralityof devices 30 in parallel. In this way, the testing section 16 canimprove the throughput of the testing.

Next, at step S15, the removing section 18 removes the device 30 forwhich testing has been completed from the test package. If the device 30is sealed between the first substrate 32 and the second substrate 34,the removing section 18 may remove the device 30 from the test packageby injecting gas between the first substrate 32 and the second substrate34.

The removing section 18 may remove, from the test package, each device30 that is judged to be an acceptable product based on the results ofthe testing of step S14. Furthermore, the removing section 18 maydispose of the test package from which the device 30 was removed.

Next, at step S16, the commercial packaging section 20 packages thedevice 30 removed from the test package in a commercial package. Thecommercial packaging section 20 may package each device 30 that isjudged to be an acceptable product based on the results of the testingin a commercial package.

The commercial packaging section 20 may package two or more device 30that were tested individually in a single commercial package. In thiscase, the commercial packaging section 20 may three-dimensionallyimplement two or more devices 30 cut from one or more wafers. Thecommercial packaging section 20 may package two or more such devices 30in a commercial package by implementing the devices 30 in a multi-chipmodule.

The device manufacturing system 10 of the present embodiment packagesthe devices 30 cut from a wafer in test packages, and tests the testpackages. Accordingly, the device manufacturing system 10 can perform,on the devices in chip form, a test that was performed on the devices 30prior to being cut from the wafer. As a result, the device manufacturingsystem 10 can eliminate wafer testing and decrease the testing cost.

FIG. 4 shows a functional configuration of the test packaging section14. The test packaging section 14 includes a detecting section 22, agenerating section 24, and a mounting section 26.

The detecting section 22 detects the position of a device terminal ofthe device 30 in chip form. The detecting section 22 may include ahandling apparatus 36, an image capturing apparatus 37, and a dataprocessing apparatus 38, for example.

The handling apparatus 36 adheres the device 30 thereto to handle thedevice 30. The image capturing apparatus 37 captures an image of thesurface of the device 30 handled by the handling apparatus 36. The dataprocessing apparatus 38 detects the position of the device terminalformed on the surface of the device 30, based on the image captured bythe image capturing apparatus 37.

The generating section 24 generates a substrate-side terminal, whichconnects to the device terminal, on a substrate forming the test packageat a position corresponding to the device terminal detected by thedetecting section 22. The generating section 24 may also generate anexternal terminal on a substrate forming the test package, forconnecting the substrate to an external apparatus. The generatingsection 24 generates a wire that connects the external terminal to thesubstrate-side terminal.

The generating section 24 may include a printing apparatus 40. Theprinting apparatus 40 prints a designated pattern on the substrate byapplying a semiconductor material on the substrate. In this way, theprinting apparatus 40 can generate the substrate-side terminal, theexternal terminal, and the wire on the substrate. The mounting section26 mounts the device 30 in chip form on the substrate and connects thedevice terminal to the substrate-side terminal.

FIG. 5 shows a process flow of the test packaging section 14 accordingto the present embodiment. FIG. 6 shows an exemplary operation performedfrom step S21 to step S24 of FIG. 5, and FIG. 7 shows an exemplaryoperation performed at step S25 of FIG. 5. FIG. 8 shows an exemplaryconnection between the device 30 and the first substrate 32. FIG. 9shows an exemplary operation performed from step S26 to step S32 of FIG.5, and FIG. 10 shows an exemplary operation performed at step S33 ofFIG. 5. FIGS. 11 and 12 show an exemplary connection between the device30, the first substrate 32, and the second substrate 34.

The flow shown in FIG. 5 represents the packaging of a device in chipform having device terminals on both surfaces, i.e. a first surface anda second surface, in a test package. First, at step S21, the detectingsection 22 handles the device 30 using the handling apparatus 36, asshown in FIG. 6, for example. In this case, the handling apparatus 36handles the device 30 by adhering the second surface of the device 30thereto. As a result, the handling apparatus 36 can handle the device 30while keeping the first surface exposed.

Next, at step S22, the detecting section 22 captures an image of thefirst surface of the device 30 using the image capturing apparatus 37,while the device 30 is handled by the device 30, as shown in FIG. 6, forexample. The detecting section 22 then uses the data processingapparatus 38 to detect the positions of first device terminals 42 formedon the first surface of the device 30, based on the image captured bythe image capturing apparatus 37.

Next, at step S23, the generating section 24 prints first substrate-sideterminals 52 on the first substrate 32 to connect to the first deviceterminals 42, at positions corresponding to the first device terminals42 of the device 30, as shown in FIG. 6, for example.

Next, at step S24, the generating section 24 uses the printing apparatus40 to print patterns of first wires 54 on the first substrate 32, toprovide conduction between prescribed positions and the firstsubstrate-side terminals 52, as shown in FIG. 6, for example. The firstwires 54 are used to connect the first device terminals 42 to the wiringpattern on the second substrate 34 connected to the external terminals58.

Next, at step S25, the mounting section 26 mounts the device 30 on thefirst substrate 32, as shown in FIG. 7, for example. In this case, themounting section 26 causes the first device terminals 42 of the device30 to contact the first substrate-side terminals 52 of the firstsubstrate 32, as shown in FIG. 8, for example. As a result, the mountingsection 26 can create electrical conduction via the first substrate-sideterminals 52 between the first wires 54 formed on the first substrate 32and the first device terminals 42 of the device 30.

Furthermore, at step S25, the mounting section 26 mounts the device 30on the first substrate 32 while maintaining the handling of step S21,i.e. without releasing the device 30 from the handling state of stepS21. As a result, the relative position of the first surface of thedevice 30 with respect to the handling apparatus 36 does not changebetween when detection is performed and when mounting is performed, andtherefore the mounting section 26 can cause the first device terminals42 and the first substrate-side terminals 52 to accurately contact eachother.

Yet further, at step S25, the mounting section 26 mounts the device 30on the first substrate 32 such that the device 30 can be removed afterthe mounting. For example, the mounting section 26 may affix the device30 to the first substrate 32 using an amount of force that does notresult in damage to the device 30 when removing the device 30 from thefirst substrate 32.

Next, at step S26, the detecting section 22 uses the handling apparatus36 to handle the device 30 while mounted on the first substrate 32, asshown in FIG. 9, for example. In this case, the handling apparatus 36handles the device 30 by adhering to the surface of the first substrate32 to which the device 30 is not affixed. In this way, the handlingapparatus 36 can handle the device 30 with the second surface thereofexposed.

Next, at step S27, the detecting section 22 uses the image capturingapparatus 37 to capture an image of the second surface of the handleddevice 30, while the device 30 is mounted on the first substrate 32, asshown in FIG. 9, for example. The detecting section 22 then uses thedata processing apparatus 38 to detect the positions of second deviceterminals 44 formed on the second surface of the device 30, based on theimage captured by the image capturing apparatus 37. Next, at step S28,the detecting section 22 uses the data processing apparatus 38 to detectthe positions of the first wires 54 printed on the first substrate 32,based on the image captured by the image capturing apparatus 37.

Next, at step S29, the generating section 24 uses the printing apparatus40 to print the patterns of the second substrate-side terminals 56,which connect to the second device terminals 44, on the second substrate34 at positions corresponding to the second device terminals 44 of thedevice 30, as shown in FIG. 9, for example. Next, at step S30, thegenerating section 24 uses the printing apparatus 40 to print thepatterns of the external terminals 58 that connect the second substrate34 to the external apparatus, as shown in FIG. 9, for example.

The external terminals 58 may be connected to through-wires thatpenetrate through the second substrate 34, for example. In this way, theexternal terminals 58 can connect the external apparatus to the secondsubstrate 34 from a surface of the second substrate 34 on the oppositeside of the surface on which the second substrate-side terminals 56 areprinted.

The external terminals 58 may be formed on the second substrate 34 inadvance. In this case, the process of step S30 is not performed. In thepresent embodiment, the external terminals 58 are formed on the secondsubstrate 34 in advance. The external terminals 58 are terminals thatpenetrate from the top surface to the bottom surface of the secondsubstrate 34, enabling connection at both the top and bottom surface.

Next, at step S31, the generating section 24 uses the printing apparatus40 to print the patterns of second wires 60 between the externalterminals 58 and the second substrate-side terminals 56, as shown inFIG. 9, for example. Next, at step S32, the generating section 24 usesthe printing apparatus 40 to print, on the second substrate 34 patternsof third wires 62 between the external terminals 58 and positionscorresponding to the first wires 54 of the first substrate 32 thatconnect to the first device terminals 42, as shown in FIG. 9, forexample. For example, the printing apparatus 40 may print the patternsof the third wires 62 between the external terminals 58 that do notconnect to second wires 60 and positions corresponding to the firstwires 54.

The intervals at which the external terminals 58 are arranged may begreater than the intervals at which the first device terminals 42 andthe second device terminals 44 are arranged on the device 30. As aresult, the external apparatus can be easily connected to the secondsubstrate 34.

Next, at step S33, the mounting section 26 suctions out the gas betweenthe first substrate 32 and the second substrate 34, thereby sealing thedevice 30 between the first substrate 32 and the second substrate 34, asshown in FIG. 10, for example. More specifically, the mounting section26 sandwiches the device 30 between the first substrate 32 and thesecond substrate 34 by placing the second substrate 34 on the surface ofthe first substrate 32 on which the device 30 is mounted, and connectsthe device 30 to the first substrate 32 and the second substrate 34. Themounting section 26 then seals the device 30 between the first substrate32 and the second substrate 34.

For example, if the first substrate 32 is a flexible substrate, themounting section 26 may seal the device 30 between the first substrate32 and the second substrate 34 by suctioning out the gas between thefirst substrate 32 and the second substrate 34. As another example, themounting section 26 may sandwich the device 30 between the firstsubstrate 32 and the second substrate 34, and then use a tensile forceto press the second substrate 34, which is a flexible substrate, againstthe first substrate 32.

Furthermore, at step S33, the mounting section 26 connects the seconddevice terminals 44 of the device 30 and the second substrate-sideterminals 56 of the second substrate 34 by bringing them into contactwith each other, as shown in FIG. 11, for example. In this way, themounting section 26 can create electrical conduction between theexternal terminals 58 formed on the second substrate 34 and the seconddevice terminals 44 of the device 30, via the second substrate-sideterminals 56 and the second wires 60.

Yet further, at step S33, the mounting section 26 connects the firstwires 54 of the first substrate 32 to the third wires 62 of the secondsubstrate 34 by bringing them into contact with each other, as shown inFIG. 12, for example. In this way, the mounting section 26 can createelectrical conduction between the external terminals 58 formed on thesecond substrate 34 and the first device terminals 42 of the device 30,via the third wires 62, the first wires 54, and the first substrate-sideterminals 52.

At step S33, the mounting section 26 also mounts the device 30 on thesecond substrate 34, while maintaining the handling of step S26, i.e.without releasing the device 30 from the handling state of step S26. Asa result, the relative position of the second surface of the device 30with respect to the handling apparatus 36 does not change between whendetection is performed and when mounting is performed, and therefore themounting section 26 can cause the second device terminals 44 and thesecond substrate-side terminals 56 to accurately contact each other, andcan also cause the first wires 54 and the third wires 62 to accuratelycontact each other.

Furthermore, at step S33, the mounting section 26 mounts the device 30on the second substrate 34 such that the device 30 can be removed afterthe mounting. For example, the mounting section 26 may affix the device30 to the second substrate 34 using an amount of force that does notresult in damage to the device 30 when removing the device 30 from thesecond substrate 34.

In the manner described above, the test packaging section 14 canmanufacture a packaged device 28 for testing that includes the firstsubstrate 32 on which the device 30 is mounted and the flexible secondsubstrate 34 that, together with the first substrate 32, sandwiches thedevice 30 by being placed on the surface of the first substrate 32 onwhich the device 30 is mounted. In other words, the test packagingsection 14 can function as a manufacturing apparatus that manufactures adevice 30 packaged in a test package.

The test packaging section 14 can package a device 30 in a manner thatenables the device 30 to be easily handled by a test apparatus, forexample. Furthermore, the test packaging section 14 can allow the testapparatus to exchange signals with the device 30 via the first substrate32 and the second substrate 34 forming the test package. Therefore, thetest packaging section 14 can enable a test apparatus to test a devicethat has been cut from a wafer prior to the device being packaged in acommercial package.

FIG. 13 shows an exemplary connection via terminal balls 66 formedbetween the device 30 and the first substrate 32. When generating thefirst substrate-side terminals 52, the generating section 24 may arrangeconductive terminal balls 66 that serve as the first substrate-sideterminals 52 on the first substrate 32 at positions corresponding to thefirst device terminals 42.

The terminal balls 66 function as the first substrate-side terminals 52when the device 30 is mounted on the first substrate 32 and the terminalballs 66 are sandwiched between the device 30 and the first substrate32. The terminal balls 66 may be spherical spacers, such as shown inJapanese Patent No. 3140995. By forming the first substrate-sideterminals 52 using the terminal balls 66, the generating section 24 canensure reliable conduction between the device 30 and the first substrate32.

Similarly, the mounting section 26 may arrange terminal balls 66 servingas the second substrate-side terminals 56 on the second substrate 34 atpositions corresponding to the second device terminals 44. In this way,the generating section 24 can form the second substrate-side terminals56 on the second substrate 34 by mounting the device 30 on the secondsubstrate 34.

FIG. 14 shows an exemplary test cell 70. After the device 30 has beenpackaged in a test package, the test packaging section 14 forms the testcell 70 by affixing the device 30 packaged in the test package to a testboard 72. The test cell 70 may include the device 30 packaged in thetest package, the test board 72, and at least one temperature controlsection 74.

The test board 72 is electrically connected to the external terminals 58of the test package, which are the external terminals 58 of the secondsubstrate 34 in the present embodiment. The test board 72 is a substratefor exchanging signals between an external test apparatus and the device30. The test board 72 may include test circuits 76, such as a circuitthat inputs and outputs signals to and from the device 30 and a circuitthat inputs and outputs signals to the external test apparatus.

The temperature control section 74 is a heating or cooling component forcontrolling the device 30 within the test package to be a prescribedtemperature. The test cell 70 may include two temperature controlsections 74 that sandwich the device 30, for example. In this way, thetemperature control sections 74 can maintain a designated temperaturefor the entire device 30. The test cell 70 can further simplify theconnection between the test apparatus and the device 30.

FIG. 15 shows an exemplary cell matrix 80. The cell matrix 80 includes aplurality of test cells 70 arranged in a three-dimensional matrix.Transport, burn-in processing, and testing can be performed for eachcell matrix 80 including a plurality of test cells 70, thereby makingthe devices 30 easy to handle and improving the throughput of thetesting.

While the embodiments of the present invention have been described, thetechnical scope of the invention is not limited to the above describedembodiments. It is apparent to persons skilled in the art that variousalterations and improvements can be added to the above-describedembodiments. It is also apparent from the scope of the claims that theembodiments added with such alterations or improvements can be includedin the technical scope of the invention.

The operations, procedures, steps, and stages of each process performedby an apparatus, system, program, and method shown in the claims,embodiments, or diagrams can be performed in any order as long as theorder is not indicated by “prior to,” “before,” or the like and as longas the output from a previous process is not used in a later process.Even if the process flow is described using phrases such as “first” or“next” in the claims, embodiments, or diagrams, it does not necessarilymean that the process must be performed in this order.

1. A manufacturing apparatus comprising: a detecting section thatdetects a position of a device terminal of a device; a generatingsection that generates a substrate-side terminal, which connects to thedevice terminal, on a substrate at a position corresponding to thedevice terminal; and a mounting section that mounts the device on thesubstrate and connects the device terminal to the substrate-sideterminal.
 2. The manufacturing apparatus according to claim 1, whereinthe detecting section captures an image of the device and detects theposition of the device terminal based on the captured image.
 3. Themanufacturing apparatus according to claim 1, wherein the generatingsection prints a pattern of the substrate-side terminal on the substrateat a position corresponding to the device terminal.
 4. The manufacturingapparatus according to claim 1, wherein the generating section arrangesconductive terminal balls that serve as the substrate-side terminal onthe substrate at a position corresponding to the device terminal.
 5. Themanufacturing apparatus according to claim 1 wherein the generatingsection prints a pattern of a wire between the substrate-side terminaland the external terminal for connecting an external apparatus to thesubstrate.
 6. The manufacturing apparatus according to claim 5, whereinthe generating section also prints the external terminal.
 7. Themanufacturing apparatus according to claim 5, wherein the generatingsection prints the pattern of the wire between the substrate-sideterminal and the external terminal, which is formed in advance on thesubstrate.
 8. The manufacturing apparatus according to claim 1, whereinthe generating section generates, on the first substrate at a positioncorresponding to a first device terminal of the device, a firstsubstrate-side terminal that connects to the first device terminal andgenerates, on the second substrate at a position corresponding to asecond device terminal of the device, a second substrate-side terminalthat connects to the second device terminal, and the mounting sectionsandwiches the device between the first substrate and the secondsubstrate to connect the device to the first substrate and the secondsubstrate.
 9. The manufacturing apparatus according to claim 8, whereinat least one of the first substrate and the second substrate is aflexible substrate, and the mounting section suctions out gas frombetween the first substrate and the second substrate to seal the devicebetween the first substrate and the second substrate.
 10. Themanufacturing apparatus according to claim 8, wherein at least one ofthe first substrate and the second substrate is a flexible substrate,and the mounting section sandwiches the device between the firstsubstrate and the second substrate by using a tensile force to press theflexible substrate against the other substrate.
 11. The manufacturingapparatus according to claim 8, wherein the generating sectiongenerates, on the first substrate at a position corresponding to thefirst device terminal, the first substrate-side terminal that connectsto the first device terminal, the mounting section connects the firstdevice terminal to the first substrate-side terminal by mounting thedevice on the first substrate, the detecting section detects a positionof the second device terminal while the device is mounted on the firstsubstrate, the generating section generates, on the second substrate ata position corresponding to the second device terminal, a secondsubstrate-side terminal that connects to the second device terminal, andthe mounting section sandwiches the device between the first substrateand the second substrate by placing the second substrate on a surface ofthe first substrate on which the device is mounted, and connects thedevice to the first substrate and the second substrate.
 12. Themanufacturing apparatus according to claim 8, wherein the mountingsection packages the device in a test package by sealing the devicebetween the first substrate and the second substrate, and after testingthe device packaged in the test package, the manufacturing apparatusremoves the device from the test package by injecting gas between thefirst substrate and the second substrate.
 13. The manufacturingapparatus according to claim 8, wherein the generating section prints,on the first substrate, at least a portion of a pattern for connectingthe first device terminal to a pattern on the second substrate connectedto the external terminal, which connects an external apparatus to thesecond substrate, and the mounting section causes the pattern on thefirst substrate connected to the first device terminal to contact thepattern on the second substrate connected to the external terminal,thereby connecting the first device terminal to the external terminal onthe second substrate.
 14. The manufacturing apparatus according to claim1, wherein the mounting section packages the device in a test packagefor testing by mounting the device on the substrate, and themanufacturing apparatus further comprises: a removing section thatremoves the device whose testing is finished from the test package; anda commercial packaging section that packages the device removed from thetest package in a commercial package.
 15. A method for manufacturing apackaged device, comprising: detecting a position of a device terminalof the device; generating a substrate-side terminal, which connects tothe device terminal, on a packaging substrate at a positioncorresponding to the device terminal; and mounting the device on thesubstrate and connecting the device terminal to the substrate-sideterminal, thereby creating conduction between an external terminalconnected to an external apparatus and the device terminal, via thesubstrate-side terminal.
 16. A packaged device comprising: a device thatincludes an electronic circuit; a first substrate on which the device ismounted: and a flexible second substrate that sandwiches the devicetogether with the first substrate, by being placed on a surface of thefirst substrate on which the device is mounted.
 17. The packaged deviceaccording to claim 16, wherein the second substrate is affixed to thefirst substrate and the device using vacuum suction or decompressionsuction.